3D Packaging Technology Engineer

About SUNY Polytechnic Institute:

Employment is with the Research Foundation for The State University of New York Polytechnic Institute (SUNY Poly)

The Research Foundation for The State University of New York (SUNY) is the largest, most comprehensive university-connected research foundation in the country. The Research Foundation manages SUNY’s research portfolio, providing essential sponsored programs administration and innovation support services to SUNY faculty, students and staff performing research in areas including life sciences and medicine; engineering and nanotechnology; physical sciences and energy; social sciences; arts and humanities; and computer and information sciences.

The Research Foundation, a private, not-for-profit corporation, is an employer separate from both SUNY and the State of New York, and offers comparable compensation and benefit plans. The Research Foundation is dedicated to the goal of building a diverse and inclusive teaching, research, and working environment. Potential applicants who share this goal, especially underrepresented minorities, women, persons with disabilities, and veterans are strongly encouraged to apply.


Job Description:

The 3D technology integration engineer responsibility will entail completing 2.5D/3D photonic packages fabricated at SUNY Poly by providing system level packaged solutions developed and fabricated at our Rochester AIM test assembly and packaging facility

This position is to be filled with an applicant that can collaborate with a cross-functional multi-diverse team that will encompass system design, silicon photonics fabrication and 3D integration while providing package assembly and test solutions to AIM Photonics customers.

Specifically, the applicant will be responsible to work with the silicon photonics team at SUNY Poly in Albany to develop packaging prototypes leading to small volume manufacturing at the Rochester packaging facility.   The applicant should have a working knowledge of organic and Silicon packaging as well as solder systems used for chip scale packaging.   The 3D packaging engineer should be able to develop state of the art packaging solutions that are cost effective and advance photonic packaging technology.

The applicant will have responsibility for the device specifications of photonic integrated devices, assisting characterization, verification, and qualification of the photonic devices within the technology.  Experience related to packaging of 3D integrated technology is highly desired.  The applicant should have a working knowledge of solder systems, plating technology, underfill/overmold technology and classical laminate packages.

The applicant should also have the ability to build full integrated routes with preferred experience in SiVIEW.  

Other reasonable duties as assigned


Requirements:

B.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

OR M.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education  or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

OR Ph.D in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education  or internationally recognized accrediting organization AND 1-3 years of relevant professional industry experience.

Prior experience with fab logistics software (SiView preferred) is recommend but not require.  Candidate will need to work in a diverse consortia environment where new photonics elements will be developed and packaging manufacturing are being developed for low cost solutions.

The ability to work well with engineers and scientists is an essential trait. Ability to work well under pressure and in a fast-paced environment is a must.  Candidate must exhibit solid leadership ability and be willing to execute a variety of tasks on short notice. 

Preferred Qualifications:

A working knowledge of silicon photonics is desirable.

Applicants must address in their applications their abilities to work with a culturally diverse population.  This position is contingent on the satisfactory completion of a background check; this position may require annual background checks.

Temporary assignment to work in Albany might be required 1- 3 months prior getting tools installed in Rochester.

Notes:  Position contingent on the availability of funding


Additional Information:

Closing date for receipt of applications: until position is filled

Research Foundation for SUNY Polytechnic Institute offers exceptional benefits such as healthcare, dental, vision, pension plans, competitive pay, generous paid time off, tuition assistance, life insurance and long-term disability insurance.

As an Equal Opportunity / Affirmative Action employer, Research Foundation for SUNY at SUNY Polytechnic Institute will not discriminate in its employment practices due to an applicant’s race, creed, religion, color, citizenship, national origin, sex, age, sexual orientation, predisposing genetic characteristics, gender identification, genetic information, familial status, marital status, pregnancy, status as a domestic violence victim, criminal conviction, disability, military status, disabled veteran, recently separated veteran, Armed Forces Service Medal veteran, active duty or wartime campaign badge veteran, or other characteristic as protected by law.. Please feel free to review your equal employment opportunities protections and laws pertaining to these protections at http://www.dol.gov/ofccp/regs/compliance/posters/pdf/eeopost.pdf

 

The Jeanne Clery Disclosure of Campus Security Policy and Campus Crime Statistics Act, or Clery Act, mandates that all Title IV institutions, without exception, prepare, publish and distribute an Annual Security Report. This report consists of two basic parts: disclosure of the College’s crime statistics for the past three years; and disclosures regarding the College’s current campus security policies. The SUNY Polytechnic Institute Annual Security Report is available in portable document format [PDF] by clicking this link: https://sunypoly.edu/app/uploads/2015/07/CleryReport2016-Utica.pdf

https://sunypoly.edu/app/uploads/2015/07/CleryReport2016-Albany.pdf

 

Inquiries regarding the application of Title IX and other laws, regulations and policies prohibiting discrimination may be directed to the Title IX Coordinator [email protected] at SUNY Polytechnic Institute. Inquiries may also be directed to the United States Department of Education’s Office for Civil Rights, 32 Old Slip 26th Floor, New York, NY 10005-2500; Tel. (646) 428-3800; Email [email protected].

Pursuant to Executive Order 161, no State entity, as defined by the Executive Order, is permitted to ask, or mandate, in any form, that an applicant for employment provide his or her current compensation, or any prior compensation history, until such time as the applicant is extended a conditional offer of employment with compensation.  If such information has been requested from you before such time, please contact the Governor’s Office of Employee Relations at (518) 474-6988 or via email at [email protected].

 


Application Instructions:

Persons interested in the above position should submit a resume, three work-related references, letter of application, along with The Research Foundation for SUNY employment application