Senior Optical Assembly Process Development Engineer – Intel – Santa Clara, CA

Job Description


Silicon Photonics Product Division SPPD is looking for a senior opto-mechanical assembly engineer in optical module engineering team. The job responsibility includes: Developing opto-mechanical packaging assembly process for state of the art Silicon Photonics SiPh devices and module, with emphasis on optoelectronic and microelectronic component and sub-systems assembly process. Assembly process designs for manufacturability and technology selection. Assess and mitigate risks associated with the product designs, assembly process/equipment/materials/throughput, etc. Identify new suppliers for design, develop and manage existing suppliers. Working with cross-functional groups to determine package requirements. Design from concept to volume production to meet the electrical, optical, mechanical, thermal, and reliability requirements. Develop assembly and test method to validate the assembly process specification design. Interacting with suppliers and optimize designs and material specification based on supplier’s processes and capabilities. Generating all component and module assembly working instruction, process development plan for product, tooling and equipment Analyze assembly data and optimize yield


Minimum 8 years of experience in the photonics or semiconductor or related industry

Proven track record in assembly process design and development from initial conceptual design to high volume production

Hands-on experience and knowledge with optoelectronic and microelectronic packaging: die-attach, wirebond, flip chip bonding, thermos-mechanical housing, micro-optics assembly passive and active alignment, laser welding, UV / thermal epoxies

Basic understanding of transceiver module assembly processes

Experience in FEA structural analysis and knowledgeable on Abaqus or ANSYS modeling tools.

Leading hands-on development of die attach and micro-lens array attach and assembly processes using micron level pick and place machines for next-generation transceiver products

Good understanding of polymer bonding adhesive material property change, adhesion strength and deformation during adhesive curing and under reliability stress Developing technical expertise on micron level pick/place and alignment machines

Excellent verbal and written communication, interpersonal skill.

Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.

Ability to work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.

Proficiency in JMP or statistical analysis tool

Demonstrated ability to juggle multiple priorities and deliver against a schedule

Team player with good communication skills.

Proven experience in executing complex projects that require cross-functional teamwork is preferred

The Data Center Group (DCG) drives new products technologies from high-end co-processors for supercomputers to low-energy systems for enterprise and the cloud, as well as solutions for big data and intelligent devices. The group is a worldwide organization that develops the products and technologies that power nine of every 10 servers sold worldwide. Inside this Business Group

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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