Principal Engineer (Advanced Package Development) – NeoPhotonics Corporation – San Jose, CA

• Serves as the domain expert and leader in the advanced opto-mechanical package field and drives development of new products utilizing such advanced optical and mechanical packaging techniques for telecom and data center application, and additionally oversees the quality enhancement of existing product packages

• Develops designs to meet the stringent requirements based on the needs from customers and market, nature of the applications, transportation methods, cost considerations, and package content characteristics

• Drives a cross functional team consisting of various skill sets to architecture, define, design, and assemble the opto-mechanical package for timely delivery to the market with high quality

• May oversee the coordination of development activities at different sites, internal and external

Requirements and Experience:

• The person should hold a Master’s degree in Mechanical, Optical, Chemical/Physics or Materials engineering with at least 15 year experience or a Ph.D. with at least 12 year relevant experience

• Extensive experience in the field of opto-mechanical device and module packaging development for telecom and data center applications

• Proven experience and track record in developing product from conception to production, and in carrying through multiple product development life cycles successfully

• Solid experience and domain expert in laser physics, free-space optics design, simulation and assembly, mechanical and thermal design and simulation, material and optical part selections, package assembly and other backend processes, module test and reliability, design miniature package for volume manufacturability.

• Must be an excellent team lead and a solid team player

• Direct experience in laser and receiver packaging, and Silicon Photonic device packaging is preferred