Optical Package Development Lead/Manager – Intel – Santa Clara, CA

Intel Data Center Group DCG – Silicon Photonics Solution Division SPPD – is looking for an optical package design engineer in R&D design team. This is a unique opportunity to join a group at the cusp of bleeding edge product and technology development with lots of growth and exciting opportunities.

The primary job responsibilities include but are not limited to the following:

• Lead or support as a part of team in developing packaging design for state of the art Silicon Photonics SiPh devices and assemblies, with emphasis on optoelectronic and microelectronic component and sub-systems
• Drive or lead photonics package design and technology selection. Assess and mitigate risks associated with the product designs
• Partner with stakeholders to identify new suppliers for design, develop and manage existing suppliers
• Interacting with suppliers and optimize designs based on supplier’s processes and capabilities
• Working with cross-functional groups to determine photonics package requirements. Design from concept to volume production to meet the electrical, optical, mechanical, thermal, and reliability requirements
• Perform tolerance analysis of opto-mechanical components and subassemblies
• Drive thermal and mechanical Finite Element Analysis FEA of packages and subassemblies, to determine temperature profiles, power dissipation and mechanical stress/deformation over temperature and their effects on optical coupling
• Lead and drive development of optical alignment system and test method to validate the design.
• Generating opto-mechanical component specifications for product and tooling

Minimum Qualifications:

• Master’s degree in physics, EE or related engineering field and 6+ years of experience in the photonics or semiconductor or related industry
• Prior design experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation
• Prior product design and development experience for active device with SM fiber pigtails
• Prior experience with optical passive and active alignments for SM fiber
• Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.
• Proven track record in product design and development cycle from initial conceptual design to high volume production
• Hands-on experience and knowledge with optoelectronic and microelectronic packaging: micro-optics assembly, fiber coupling design and development, epoxies, laser welding, die-attach, wirebond, leadframe etc.
• Working knowledge with optical alignment and optical system testing
• Team player with good communication skills.
• Excellent verbal and written communication, interpersonal skill.
• Demonstrated ability to juggle multiple priorities and deliver against a schedule.

Preferred Qualifications:

• PhD in physics, EE or related engineering field and 4+ years of experience in the photonics or semiconductor or related industry
• Experience in product thermal design. Proficient in ICEPAK and/or FLOTHERM CFD modeling tools is a plus.
• Experience in FEA structural analysis and knowledgeable on modeling tools such as Abaqus or ANSYS is a plus.
• Experience and knowledgeable with optical simulation and tools, such as Zemax is a plus

Qualifications

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